AHK-Cu

Overview

Synthetic copper-binding tripeptide targeting dermal papilla cells and hair follicles. Stimulates hair follicle elongation, promotes cell proliferation, increases VEGF production, and inhibits TGF-β1. Supports skin regeneration through fibroblast activation and collagen synthesis.

Mechanism of action

AHK-Cu penetrates scalp delivering copper directly to dermal papilla cells. Activates proliferation pathways, elevates Bcl-2/Bax ratio (anti-apoptotic), increases VEGF for blood flow, reduces TGF-β1, and promotes SOD production for oxidative stress reduction.

Key research findings

• Hair follicle elongation stimulation
• Dermal papilla cell proliferation
• VEGF upregulation for improved scalp circulation
• TGF-β1 reduction (counters DHT effects)
• Anti-apoptotic protection for follicles
• Collagen synthesis support
• Convenient topical application
• Fibroblast activation for skin regeneration

Research applications

Hair Growth

• Hair Follicle Elongation — Ex vivo studies demonstrate AHK-Cu stimulates human hair follicle elongation at concentrations as low as 10⁻¹² M, promoting longer anagen phase.
• Dermal Papilla Cell Proliferation — Increases proliferation of dermal papilla cells, the key regulatory cells for hair follicle cycling and hair growth.
• VEGF Upregulation — Boosts vascular endothelial growth factor production, improving blood flow and nutrient delivery to hair follicles.
• Anti-DHT Mechanism — Reduces TGF-β1 secretion and oxidative stress (via SOD), both contributing to DHT-induced follicle miniaturization.

Skin Regeneration

• Fibroblast Stimulation — Activates fibroblast proliferation and collagen synthesis for improved skin structure and wound healing.
• Anti-Apoptotic Effects — Elevates Bcl-2/Bax ratio and reduces caspase-3 activation, protecting cells from programmed death.
• Extracellular Matrix Support — Promotes collagen and ECM component deposition for tissue renewal and repair.